Intel says that 'Intel 7,' the process formerly known as '10nm Enhanced SuperFin,' will ship this year for client (Alder Lake), and for the data center (Sapphire Rapids) in the first quarter of 2022. Similarly, Intel's 7nm, which it recently announced will be delayed, is now branded as 'Intel 4.' The remaining two entries on the roadmap, 'Intel 3' and 'Intel 20A' represent what intel previously branded as 7+ and 5nm, respectively. However, as noted above, 'Intel 7' is the same 10nm Enhanced SuperFin process that Intel has already announced will power its Alder Lake and Sapphire Rapids chips - it just has a new name. Intel's roadmap below starts with the 10nm SuperFin that currently ships in some of its products, like its Tiger Lake processors.
We'll come back to expand on this topic a bit later in the article. In either case, Intel will eventually have to take criticism for making a change to its nomenclature at some point, and it has chosen to do so with its next line of chips. However, changing the 10nm Enhanced SuperFin naming while the 'vanilla' 10nm SuperFin is already shipping definitely isn't as ideal as waiting for an entirely new node to make the change - this approach is unquestionably more confusing. Intel's fledging foundry services business also notched two big wins, with AWS announcing that it will use Intel's packaging services while Qualcomm announced that it will explore using Intel's 20A process for future chip designs. Intel also shared details of its future Foveros Omni and Direct technologies during its 'Intel Accelerated' webcast (opens in new tab) and announced that its Sapphire Rapids chips would be the "first dual-reticle-sized device" in the industry. Intel says its process tech will match the current industry leader, TSMC, by 2024, and that it will retake 'process performance leadership' by 2025, helped along by being the first company to receive a next-gen High NA EUV machine from ASML for its next-gen chips. That re-branding begins with Intel's 10nm Enhanced SuperFin, which will now be renamed to 'Intel 7.' Intel will also change its process node naming scheme again, this time to match the naming used by external foundries like TSMC. Intel also teased the first details of its angstrom-class (the next measurement below nanometer) technology, like RibbonFET, its first new transistor design since FinFET arrived a decade ago, and PowerVia, a new backside power delivery technique that sandwiches the transistors between layers of wiring. Intel CEO Pat Gelsinger whipped the covers off the company's new process and packaging roadmap that now stretches out to 2025, outlining an annual cadence of the company's future process nodes spanning from standard nanometer-scale tech down to incredibly small angstrom-class transistors.
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